C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 22/05 (2006.01) C23F 11/10 (2006.01) C23F 11/14 (2006.01) H05K 3/06 (2006.01) H05K 3/28 (2006.01)
Patent
CA 2123183
An water-based surface treatment agent used for the copper on a printed wiring board (PWB). Chemical layer formed on PWB shows excellent heat-resistance and moisture-resistance; therefore, the treated PWB preserve s excellent soldability for a long time. The water-based surface treatment agent contains, as an active ingredien t, a 2-arylimidazole compound represented by the following formula, (see formula I) wherein R is a hydrogen atom or a methyl group, R1 and R2 are hydrogen atoms, lower alkyl groups or halogen atoms, and R3 and R4 are hydrogen atoms, lower alkyl groups, halogen atoms, lower alkoxy groups, di-lower alkylamino groups, cyano groups or nitro groups, or (see formula II) wherein R is a hydrogen atom or a methyl group, and R1 and R2 are hydrogen atoms, lower alkyl groups or halogen atoms, but excluding the case the case where R, R1 and R2 are all hydrogen atoms.
Hirao Hirohiko
Kikukawa Yoshimasa
Murai Takayuki
Nakayama Rie
Okamoto Toshihiro
Shikoku Chemicals Corporation
Smart & Biggar
LandOfFree
Agent for treating surfaces of copper and copper alloys does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Agent for treating surfaces of copper and copper alloys, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Agent for treating surfaces of copper and copper alloys will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-2008196