Air-cooled hybrid electronic package

Details Air-cooled hybrid electronic package Air-cooled hybrid electronic package

H - Electricity

05

K

347/36

H05K 7/20 (2006.01) H05K 1/14 (2006.01)

Patent

CA 1133106

AIR-COOLED HYBRID ELECTRONIC PACKAGE Abstract of the Disclosure Metallized ceramic modules (MC), which are mounted on printed circuit cards, and multi-layer ceramic modules (MLC), which are mounted on a printed circuit planar board, are combined into one hybrid package. An air cooling distribution system is provided wherein air is first caused to impinge against the multi-layer ceramic modules after which it is directed to flow serially across the metal- lized ceramic modules. EN979021

363543

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