Airless spray method of coating circuit boards

Details Airless spray method of coating circuit boards Airless spray method of coating circuit boards

H - Electricity

05

K

356/7

H05K 3/00 (2006.01) B05B 1/04 (2006.01) B05B 13/04 (2006.01) B05D 1/02 (2006.01) B05D 1/32 (2006.01) H05K 3/28 (2006.01)

Patent

CA 1255013

ABSTRACT The specification describes a method of applying a moisture proof insulator to a packaged circuit board by means of low pressure airless spraying. A liquid film of the insulator material is ejected by a single, flat-pattern nozzle to coat the circuit board in strips. Subsequent passes of the nozzle lays down adjoining strips resulting in a planar coating. Ejection is stopped over areas which are to be left uncoated.

521497

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