Alignment apertures in an optically transparent substrate

Details Alignment apertures in an optically transparent substrate Alignment apertures in an optically transparent substrate

G - Physics

02

B

G02B 6/36 (2006.01) G02B 6/42 (2006.01) G02B 6/38 (2006.01)

Patent

CA 2445971

A method and apparatus are provided for aligning a set of connector guide pins (20) to an optical array (12), the method comprises the steps of disposing the optical array on a transparent substrate (16) such that an axis of transmission of the optical array passes directly through the transparent substrate, disposing a heatsink with a set of alignment guide pins on a rear surface of the optical array with the set of alignment guide pins extending through the transparent substrate, disposing a heatsink with a set of alignment guide pins on the rear surface of the optical array with the set of alignment guide pins extending through the transparent substrate on either side of the optical array, and slotting a set of holes where the set of alignment guide pins extend through the transparent substrate to allow for thermal expansion.

L'invention concerne un procédé et un appareil destinés à aligner un ensemble de tiges de guidage connectrices (20) à un réseau optique (12). Ce procédé consiste à déposer le réseau optique sur un substrat transparent (16) de sorte qu'un axe de transmission du réseau optique passe directement à travers le substrat transparent, à déposer un dissipateur thermique avec un ensemble de tiges de guidage d'alignement sur la surface arrière du réseau optique avec l'ensemble de tiges de guidage d'alignement s'étendant à travers le substrat transparent de chaque côté du réseau optique, et à percer un ensemble de trous à l'endroit où l'ensemble de tiges de guidage d'alignement s'étend à travers le substrat transparent afin de permettre une dilatation thermique.

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