Alignment of integrated optical components

G - Physics – 02 – B

Patent

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G02B 6/42 (2006.01) G02B 6/12 (2006.01)

Patent

CA 2128534

A method for connecting two components (10, 11) with functional parts (12, 19) thereof in a predetermined alignment such as a semiconductor laser (11) and motherboard (10), comprising forming the laser (11) by processing in which the radiation outlet (19) and alignment means (21) are provided in a predetermined position with respect to each other, similarly forming on the motherboard (10), a waveguide (12) and alignment means (16, 14), mounting the laser (11) on the motherboard (10) in a generally aligned position, providing solder (26) between metal pads (18, 22) on the laser (11) and motherboard (10), and utilizing the sur- face tension of the molten metal (26) extending between the pads (18, 22) to move the laser (11) into an accurately aligned posi- tion on the motherboard (10).

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