Alignment of leads for ceramic integrated circuit packages

Details Alignment of leads for ceramic integrated circuit packages Alignment of leads for ceramic integrated circuit packages

H - Electricity

01

L

356/143, 356/194

H01L 21/48 (2006.01) H01L 23/498 (2006.01) H01L 23/50 (2006.01)

Patent

CA 1292326

ALIGNMENT OF LEADS FOR CERAMIC INTEGRATED CIRCUIT PACKAGES ABSTRACT OF THE DISCLOSURE An alignment system comprising a rectangular leadframe from the interior of which extend leads to terminations arrangement for alignment and registration with the braze pads of a ceramic integrated circuit package, the alignment and registration being maintained and defined by a web bar interconnecting the leads adjacent and between those braze pads and the leadframe. The leadframe, leads and web bar are integrally formed by etching and lie in a plane.

592906

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