Alkenyl-modified polyimides

C - Chemistry – Metallurgy – 08 – G

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C08G 73/12 (2006.01) C08F 222/40 (2006.01)

Patent

CA 1338630

(a) Polyimides of the general formula (I) Image (I) wherein x is an integer of at least 2, B represents a divalent residue containing a carbon-carbon double bond, and wherein A represents an x-valent, wherein x is said integer of at least 2, and (b) alkenylphenols or compositions of alkenylphenols selected frcm: .alpha.-.alpha.'-bis (3-alkenyl-4-hydroxyphenyl) p-diisopropylbenzene .alpha.-.alpha.'-bis (3-alkenyl-4-hydroxyphenyl) m-diisopropylbenzene 2,2'-bis (3-alkenyl-4-hydroxyphenyl) perfluoropropane 9,9'-bis (3-alkenyl-4-hydroxyphenyl) fluorene or ethers thereof; these curable compositions can be employed to produce resins which are both tough and thermally stable afte poly- merization.

608362

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