All metal flat package

Details All metal flat package All metal flat package

H - Electricity

05

K

26/112, 347/33

H05K 5/04 (2006.01) H01L 21/50 (2006.01) H01L 23/047 (2006.01)

Patent

CA 1114936

ALL METAL FLAT PACKAGE ABSTRACT An all-metal flat package for microcircuits is described which has a molybdenum bottom and a kovar frame. Large 96% alumina substrates carrying heat dissipating microcircuits can readily be soldered into the package which has good transfer characteristics.

335597

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