H - Electricity – 05 – K
Patent
H - Electricity
05
K
26/112, 347/33
H05K 5/04 (2006.01) H01L 21/50 (2006.01) H01L 23/047 (2006.01)
Patent
CA 1114485
ALL METAL FLAT PACKAGE HAVING EXCELLENT HEAT TRANSFER CHARACTERISTICS ABSTRACT An all-metal flat package for microcircuits is described which has a copper bottom and a stainless steel frame. Beryllia substrates carrying power chips can readily be soldered into the package which has good heat transfer characteristics.
335599
Isotronics Incorporated
Sim & Mcburney
LandOfFree
All metal flat package having excellent heat transfer... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with All metal flat package having excellent heat transfer..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and All metal flat package having excellent heat transfer... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1160551