All metal flat package having excellent heat transfer...

Details All metal flat package having excellent heat transfer... All metal flat package having excellent heat transfer...

H - Electricity

05

K

26/112, 347/33

H05K 5/04 (2006.01) H01L 21/50 (2006.01) H01L 23/047 (2006.01)

Patent

CA 1114485

ALL METAL FLAT PACKAGE HAVING EXCELLENT HEAT TRANSFER CHARACTERISTICS ABSTRACT An all-metal flat package for microcircuits is described which has a copper bottom and a stainless steel frame. Beryllia substrates carrying power chips can readily be soldered into the package which has good heat transfer characteristics.

335599

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