Aluminium cored board and method for manufacturing same

Details Aluminium cored board and method for manufacturing same Aluminium cored board and method for manufacturing same

H - Electricity

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L

356/9

H01L 21/58 (2006.01) H05K 1/02 (2006.01) H05K 3/00 (2006.01)

Patent

CA 1225462

ABSTRACT OF THE DISCLOSURE It is disclosed that an aluminium cored board comprising an aluminium core, a copper plating layer formed on the surface of the aluminium core, a baked organic polymer insulating layer formed on the copper plating layer, and a layer of an electrically conductive metal which is adhered on the baked organic polymer insulating layer, and a method for manufacturing an aluminium cored board which comprises a step to treat the surface of an alu- minium core with a zincate, a step to form a copper plating layer on the zincate-treated surface, a step to form an electrical insulating layer on the copper plating layer by coating an insulating varnish and baking thereof, and a step to adhere a foil of an electrically conductive metal on the electrical insulating layer.

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