H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/143
H01L 23/06 (2006.01) H01L 23/057 (2006.01) H01L 23/10 (2006.01) H01L 23/14 (2006.01)
Patent
CA 1296815
ABSTRACT OF THE INVENTION The present invention relates to a package (10) adapted to house an electronic device (12), such as a semiconductor integrated circuit. The package (10) components are comprised of aluminum or an aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than copper based packages and better thermal conductivity than plastic based packages. (DRAWING FIGURE 1)
611865
Mahulikar Deepak
Popplewell James Malcolm
Olin Corporation
Swabey Ogilvy Renault
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