C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 17/00 (2006.01) C25D 3/44 (2006.01) C25D 17/12 (2006.01) C25D 17/28 (2006.01)
Patent
CA 2045710
ALUMINUM ELECTROPLATING APPARATUS Abstract of the Disclosure An entrance chamber is provided adjacent a plating chamber at a substantially same level as the plating chamber. A carrier is provided for supporting a jig for hanging a workpiece and for conveying the jig between the entrance chamber and the plating chamber. A conveying device is provided in the plating chamber for conveying the jig between the carrier and a plating tank in the plating chamber for performing the plating of the workpiece.
Asakawa Kiyoshi
Mori Jyun
Narada Tadaaki
Saeki Isao
Sugiura Yutaka
Mitsubishi Chemical Corporation
Ridout & Maybee Llp
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