Aluminum nitride circuit board and method of producing same

Details Aluminum nitride circuit board and method of producing same Aluminum nitride circuit board and method of producing same

H - Electricity

05

K

H05K 1/02 (2006.01) H01L 21/48 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01) H05K 3/10 (2006.01) H05K 3/40 (2006.01) H05K 1/11 (2006.01) H05K 3/24 (2006.01) H05K 3/38 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2105448

ALUMINUM NITRIDE CIRCUIT BOARD AND METHOD OF PRODUCING SAME ABSTRACT OF THE DISCLOSURE An aluminum nitride circuit board includes an aluminum nitride ceramic body. An inner conductor metal which is to be used as a wiring material is formed in the aluminum nitride ceramic body. The inner conductor metal is mainly made of copper, a melting point of which is lower than a firing temperature of the aluminum nitride ceramic. A layer mainly made of a periodic table IVa group metal or compound, such as titanium, zirconium, or hafnium, is formed in an interface between the aluminum nitride ceramic body and the inner conductor metal.

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