Aluminum-palladium alloy for initiation of electroless plating

Details Aluminum-palladium alloy for initiation of electroless plating Aluminum-palladium alloy for initiation of electroless plating

C - Chemistry, Metallurgy

23

C

C23C 18/18 (2006.01) C23C 18/31 (2006.01) C23C 18/32 (2006.01) H01L 21/288 (2006.01) H01L 21/306 (2006.01) H01L 21/3205 (2006.01)

Patent

CA 2140172

Thin layers of aluminum (13) and palladium (12) are deposited and annealed to produce aluminum-palladium alloy (14). The surface of the alloy (14) is exposed and treated with an aluminum etchant to produce a catalytic surface (15). The catalytic surface is used for electroless plating of nickel, providing excellent plating uniformity and adhesion, as well as a reduced plating induction time. Several variants of the basic method are possible.

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