H - Electricity – 01 – L
Patent
H - Electricity
01
L
345/23
H01L 31/02 (2006.01) H01L 31/0392 (2006.01) H01L 31/18 (2006.01) H01L 31/20 (2006.01)
Patent
CA 1218135
ABSTRACT OF THE DISCLOSURE A multilayer structure comprises at least one layer of an amorphous silicon semiconductor material in contact with the surface of two layer laminated metal or alloy film present upon an aluminum plate or film base and formed by electroplating the aluminum plate or film base. Such a structure is particularly useful as a solar cell.
437485
Konagai Makoto
Omori Takeshi
Takahashi Kiyoshi
Yoshitomi Toshihiko
Mitsubishi Chemical Industries Limited
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
LandOfFree
Aluminum plate with electroplated metal laminate in contact... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Aluminum plate with electroplated metal laminate in contact..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Aluminum plate with electroplated metal laminate in contact... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1223945