Aluminum polishing compositions

Details Aluminum polishing compositions Aluminum polishing compositions

C - Chemistry, Metallurgy

09

G

6/8

C09G 1/04 (2006.01)

Patent

CA 1114104

ABSTRACT OF THE DISCLOSURE An aluminium polishing bath contains phosphoric acid, sulphuric acid, nitric acid, dissolved copper, dissolved aluminium, organic etch inhibitor and water. The presence of the organic etch inhibitor permits the-proportion of sulphuric acid in an aluminium polishing solution to be increased substantially, so that phosphoric acid and sulphuric acid, used in relative proportions of 1:2 to 3:1, constitute at least 90% of the total composition.

378068

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