Ammonia-free deposition of copper by disproportionation

Details Ammonia-free deposition of copper by disproportionation Ammonia-free deposition of copper by disproportionation

C - Chemistry, Metallurgy

23

C

C23C 18/40 (2006.01) C23C 18/38 (2006.01) H05K 3/18 (2006.01)

Patent

CA 2175909

An ammonia-free reducer is added to cupric ions to achieve reduction to cuprous hydroxide in a process for the deposition of metallic copper on a catalytically activated surface by rapidly reducing cupric ions in aqueous solution to cuprous hydroxide, without substantial reduction to elemental or metallic copper, and thereafter effecting controlled disproportionation of the resultant cuprous hydroxide to bring about the deposition of metallic copper. The ammonia-free reducer is preferably hydroxylamine or its salts in the presence of a water soluble alkali metal - or alkaline earth metal - hydroxide, more preferably sodium hydroxide.

On ajoute un réducteur exempt de gaz ammoniac à des ions cuivriques pour obtenir de l'hydroxyde cuivreux, dans un procédé de formation d'un dépôt de cuivre métallique sur une surface ayant subi une activation catalytique. Les ions cuivriques sont réduits rapidement dans une solution aqueuse en hydroxyde de cuivre, sans réduction sensible en cuivre élémentaire ou métallique. Ensuite, on procède à un disproportionnement régulé de l'hydroxyde de cuivre résultant pour former un dépôt de cuivre métallique. Le réducteur exempt de gaz ammoniac est de préférence l'hydroxylamine ou ses sels, en présence d'un hydroxyde hydrosoluble de métal alcalin ou alcalino-terreux, de préférence l'hydroxyde de sodium.

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