An apparatus, a method for establishing a conductive pattern...

H - Electricity – 05 – K

Patent

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H05K 3/10 (2006.01) C23C 24/08 (2006.01) C23C 26/00 (2006.01)

Patent

CA 2723886

An apparatus, a method, a planar insulating substrate and a chipset have been presented, comprising at least one module configured to establish a predefined pattern on a planar insulating substrate so that conductive particles can gather according to the predefined pattern. At least one another module is configured to transfer the conductive particles to the planar insulating substrate, wherein the conductive particles are arranged to gather according to the predefined pattern. A sintering module is configured to fuse the conductive particles on the planar insulating substrate, wherein the conductive particles are arranged to fuse according to the predefined pattern to establish a conductive plane on the planar insulating substrate. Embodiment of the invention relate to printable or printing electronics on a fibrous web.

L'invention porte sur un appareil, un procédé, un substrat isolant plan et un jeu de puces, renfermant au moins un module configuré pour établir un motif prédéfini sur un substrat isolant plan, de telle sorte que des particules conductrices peuvent se réunir selon le motif prédéfini. Au moins un autre module est configuré pour transférer les particules conductrices au substrat isolant plan, les particules conductrices étant agencées pour se réunir selon le motif prédéfini. Un module de frittage est configuré pour fondre les particules conductrices sur le substrat isolant plan, les particules conductrices étant agencées pour fondre selon le motif prédéfini afin d'établir un plan conducteur sur le substrat isolant plan. Un mode de réalisation de l'invention porte sur de l'électronique imprimable ou imprimée sur une bande fibreuse.

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