An apparatus and a method for tapping metal

C - Chemistry – Metallurgy – 25 – C

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C25C 3/24 (2006.01) C25C 3/06 (2006.01)

Patent

CA 2668013

An apparatus and a method for tapping molten metal from below a molten electrolyte layer less dense than the metal is described. The apparatus comprises a pipe comprising a protruding enlarged wall portion at an operative end which is immersed in the molten electrolyte and metal during tapping operation. The enlarged wall portion helps to minimize entrainment of electrolyte residue from the electrolyte/metal interface during tapping. The orientation of the enlarged wall portion may be in the general direction of the crucible.

La présente invention concerne un appareil et un procédé pour couler du métal fondu se situant en dessous d'une couche d'électrolyte fondue moins dense que le métal. L'appareil comprend une conduite comprenant une partie de paroi élargie en saillie à une extrémité fonctionnelle laquelle est immergée dans l'électrolyte et le métal fondus pendant l'opération de coulage. La partie de paroi élargie aide à minimiser l'entraînement du résidu d'électrolyte à partir de l'interface électrolyte/métal pendant le coulage. L'orientation de la partie de paroi élargie peut être dans la direction générale du creuset.

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