An electronic-circuit assembly and its manufacturing method

Details An electronic-circuit assembly and its manufacturing method An electronic-circuit assembly and its manufacturing method

H - Electricity

05

K

H05K 1/14 (2006.01) H01L 25/065 (2006.01) H05K 3/36 (2006.01) H05K 3/46 (2006.01) H05K 1/02 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2199796

An electronic-circuit assembly of the present invention comprises a plurality of film carriers which are stacked. Respective film carriers have a plurality of through-holes. One of through-holes is provided on corresponding position to another through-hole in the stacked direction of the substrate. Two of adjacent film carriers are connected by the corresponding through-holes. A connection member is provided in two of adjacent through-holes in the stacked direction of the substrates. A connection state between film carriers can be easily checked. Since it is visually checked that solder appears invite the topmost through-hole. Furthermore, wiring lengths for connection between substrates can be reduced. Since the plurality of substrates are three-dimensionally connected.

Circuit électronique comportant plusieurs bandes porte-puces empilées. Chaque bande porte-puces contient plusieurs trous. Un trou est prévu à la position correspondante à un autre trou dans le sens de la superposition du substrat. Deux bandes porte-puces adjacentes sont connectées par le biais de trous correspondants. Un élément connecteur est prévu dans deux des trous adjacents dans le sens de la superposition des substrats. La connexion entre les bandes porte-puces peut être facilement vérifiée. Puisque qu'il faut vérifier visuellement la soudure, elle apparaît à l'intérieur du trou le plus élevé. En outre, la longueur des fils pour la connexion entre les substrats peut être réduite, car les nombreux substrats sont connectés de façon tridimensionnelle.

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