An electronic device assembly and a manufacturing method of...

Details An electronic device assembly and a manufacturing method of... An electronic device assembly and a manufacturing method of...

H - Electricity

05

K

H05K 1/14 (2006.01) H01L 23/498 (2006.01) H05K 3/34 (2006.01) H05K 3/36 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2156795

An electronic device assembly includes a rigid, first substrate and a second substrate. The first substrate has a first pad on the upper surface, and a through-hole at a position of the first pad. The second substrate has a second pad on the upper surface thereof. The first and second pads are connected via solder. At least a part of the solder is positioned in the through-hole of the first substrate. The first substrate may include a flexible substrate and a rigid plate. The through-hole is provided in the flexible substrate. The first pad is provided on the lower surface of the flexible substrate. The rigid plate is attached to the flexible substrate. The plate has a hole at a position of the through-hole to make the first pad reachable.

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