C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 3/12 (2006.01) C25D 3/56 (2006.01) C25D 5/18 (2006.01)
Patent
CA 2224382
An electroplating method of forming platings of nickel, cobalt, nickel alloys or cobalt alloys with reduced stresses in an electrodepositing bath of the type: Watt's bath, chloride bath or a combination thereof, by employing pulse plating with periodic reverse pulse and a sulfonated naphthalene additive. This method makes it possible to deposit nickel, cobalt, nickel or cobalt platings without internal stresses.
La présente invention concerne un procédé de réalisation de plaquages de nickel, de cobalt, d'alliages de nickel ou d'alliages de cobalt par galvanoplastie présentant de moindres contraintes dans un bain d'électrodéposition tel qu'un bain de Watt, un bain de chlorure ou un mélange des deux. On utilise pour cela un procédé de plaquage par impulsions à impulsions inverses périodiques et un additif de naphtalène sulfoné. Ce procédé permet de réaliser un plaquage de nickel, de cobalt, d'alliages de nickel ou d'alliages de cobalt sans contraintes internes.
Dylmer Henrik
Moller Per
Tang Peter Torben
Dylmer Henrik
Marks & Clerk
Moller Per
Tang Peter Torben
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