H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 5/06 (2006.01) B29C 45/14 (2006.01) G06K 19/077 (2006.01)
Patent
CA 2658024
An embedded electronic device (1) and a method for manufacturing the same wherein the embedded electronic device (1) is composed of a printed circuit board (10), having a top surface (11) and a bottom surface (12), a plurality of circuit components (20) attached to the top surface (11) of the printed circuit board (10) having a plurality of standoffs (13) on the bottom surface (12) of the printed circuit board (10), a bottom overlay (30) attached to the bottom surface of the printed circuit board (10), a top overlay (40) positioned above the top surface of the printed circuit board (10) and a core layer (50) positioned between the top surface (11) of the printed circuit board (10) and the top overlay (40).
La présente invention concerne un dispositif électronique noyé (1) et un procédé de fabrication de celui-ci. Le dispositif électronique noyé (1) est composé d'une carte de circuit imprimé (10), comportant une surface supérieure (11) et une surface inférieure (12), une pluralité de composants de circuit (20) fixés à la surface inférieure (11) de la carte de circuit imprimé (10) comportant une pluralité d'écartements (13) sur la surface inférieure (12) de la carte de circuit imprimé (10), un revêtement inférieur (30) fixé sur la surface inférieure de la carte de circuit imprimé (10), un revêtement supérieur (40) positionné au-dessus de la surface supérieure de la carte de circuit imprimé (10) et une couche de noyau (50) positionnée entre la surface supérieure (11) de la carte de circuit imprimé (10) et le revêtement supérieur (40).
Keim Lawrence J.
Singleton Robert
Goudreau Gage Dubuc
Innovatier Inc.
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