H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 27/00 (2006.01) H01L 21/311 (2006.01) H01L 21/312 (2006.01) H01L 21/77 (2006.01)
Patent
CA 2214109
This invention discloses a method for coating an integrated circuit (3) with a layer of plasma deposited polymers (PDP) ablateable by visible light laser radiation.
L'invention concerne un procédé permettant de recouvrir un circuit intégré (3) avec une couche de polymères déposés par plasma (PDP) qui peuvent subir une ablation par l'application d'un rayonnement laser à lumière visible.
Cassuto Yoram
Janai Meir
Silverstein Michael Stephen
Zehavi Sharone
Chip Express Corporation
Kirby Eades Gale Baker
LandOfFree
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