An inorganic separator stack to micro-pattern organic layers

Details An inorganic separator stack to micro-pattern organic layers An inorganic separator stack to micro-pattern organic layers

H - Electricity

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H01L 21/302 (2006.01) G02B 6/136 (2006.01) H01L 21/033 (2006.01) H01L 21/312 (2006.01) H01L 27/32 (2006.01) G02B 6/12 (2006.01)

Patent

CA 2291302

A patterned layer of organic material is formed on a substrate by depositing a composite stack of at least two inorganic layers on the substrate. The inorganic layers have different etch rates, with the upper layer having a lower etch rate than the underlying layer. The composite stack is masked to leave exposed portions defining a pattern. The exposed portions are then etched away to form a separator with an overhang resulting from the different etch rates of the layers. An organic layer is deposited on the resulting structure using a directional deposition technique to form a patterned organic layer.

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