An optoelectronic assembly and method for fabricating the same

Details An optoelectronic assembly and method for fabricating the same An optoelectronic assembly and method for fabricating the same

G - Physics

02

B

G02B 6/36 (2006.01) G02B 6/42 (2006.01) G02B 27/62 (2006.01)

Patent

CA 2383949

A package for optical components (16, 18, 22) and a method for making the package (10) are disclosed. The package (10) comprises a quasi-planar substrate (12) having a positioning floor (14), a platform (20) and an optional ring frame (32) of precisely determined height. Optical components (16, 18, 22) are picked and placed on a substrate floor (14), a raised platform (20) and frame (32). A flexure assembly (24) allows fine positioning of components (22) requiring critical optical alignment.

L'invention porte sur un boîtier (10) de composants (16, 18, 22) optiques et sur un procédé de fabrication de ce boîtier (10). Le boîtier (10) comprend un substrat (12) quasi plan doté d'un fond (14) de positionnement, d'une plate-forme (20) et d'un cadre (32) périphérique éventuel dont le poids est déterminé avec précision. Les composants (16, 18, 22) optiques sont prélevés et placés sur le fond (14) du substrat, sur une plate-forme (20) surélevée et un cadre (32). Un ensemble (24) flexible permet un positionnement précis des composants (22) nécessitant un alignement optique critique.

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