C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
400/1, 402/451,
C08F 20/40 (2006.01) C08L 33/14 (2006.01) C09J 4/00 (2006.01) C09J 5/00 (2006.01)
Patent
CA 1139495
Abstract of the Disclosure This invention relates to liquid adhesive and/or sealing compositions capable of hardening or curing under exclusion of oxygen comprising dicyclopentenyloxyethyl acrylate and/or methacrylate and an organic peroxy compound having 3 to 18 carbon atoms selected from the group consisting of organic peroxides and organic hydroperoxides, preferably the latter, and an imide or amine accelerator.
332655
Emmons William D.
Moser Vincent J.
Gowling Lafleur Henderson Llp
Rohm And Haas Company
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