Anaerobic adhesive and/or sealing compositions, and methods...

C - Chemistry – Metallurgy – 08 – F

Patent

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400/1, 402/451,

C08F 20/40 (2006.01) C08L 33/14 (2006.01) C09J 4/00 (2006.01) C09J 5/00 (2006.01)

Patent

CA 1139495

Abstract of the Disclosure This invention relates to liquid adhesive and/or sealing compositions capable of hardening or curing under exclusion of oxygen comprising dicyclopentenyloxyethyl acrylate and/or methacrylate and an organic peroxy compound having 3 to 18 carbon atoms selected from the group consisting of organic peroxides and organic hydroperoxides, preferably the latter, and an imide or amine accelerator.

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