Anisotropic conductive adhesive compositions

Details Anisotropic conductive adhesive compositions Anisotropic conductive adhesive compositions

C - Chemistry, Metallurgy

09

J

356/193, 400/790

C09J 9/02 (2006.01) C09J 201/00 (2006.01) C09J 201/06 (2006.01) H05K 3/32 (2006.01)

Patent

CA 2274863

A novel thermally reworkable anisotropic conductive adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises (a) a thermally reworkable cross-linked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and (b) at least one electrically conductive material present in an effective amount to provide a conducting medium in only one direction.

On décrit une nouvelle composition d'adhésif conducteur anisotrope thermiquement recyclable destinée à fixer un dispositif semi-conducteur sur un substrat. La composition contient: (a) une résine réticulée thermiquement, recyclable, produite par réaction d'au moins un diénophile d'une fonctionnalité supérieure à un et d'au moins un polymère contenant du furan à substitution 2,5-dialkyle; et (b) au moins une matière électro-conductrice présente dans une quantité suffisante pour produire un milieu conducteur unidirectionnel.

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