Anisotropic conductive adhesive film

Details Anisotropic conductive adhesive film Anisotropic conductive adhesive film

C - Chemistry, Metallurgy

09

J

C09J 9/02 (2006.01) C08G 59/40 (2006.01) C09J 163/00 (2006.01) C09J 177/00 (2006.01) H01B 1/22 (2006.01) H05K 3/32 (2006.01)

Patent

CA 2113090

2113090 9301248 PCTABS00019 A composition for forming an anisotropic conductive film having a rapid curing speed, high heat resistance, high humidity resistance, long shelf life and excellent repairability comprising an adhesive composition containing about 100 parts cyanate ester, from about 0.01 part to 10 parts of a curing catalyst, from about 10 parts to about 300 parts of a film-formable thermoplastic resin, and from about 10 to about 500 parts of an epoxy resin, and from about 0.1 part to about 20 parts conductive particles per 100 parts total adhesive composition.

Affiliated with

Also associated with

Rating

Anisotropic conductive adhesive film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Anisotropic conductive adhesive film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Anisotropic conductive adhesive film will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1876313