H - Electricity – 01 – F
Patent
H - Electricity
01
F
H01F 1/053 (2006.01) H01F 1/057 (2006.01)
Patent
CA 2079223
ABSTRACT OF THE DISCLOSURE A hot press molded body or an HIP molded body having one of a composition comprising R: 10 - 20 atomic %, B: 3 - 20 atomic %, and a total amount of one or a plurality of Ga, Zr, and Hf: 0.001 - 5.5 atomic %, a remainder comprising Fe and unavoidable impurities; or a composition comprising R: 10 - 20 atomic %, B: 3 - 20 atomic %, and a total amount of one or a plurality of Ti, V, Nb, Ta, Al, and Si: 0.001 5.0 atomic %, a remainder comprising Fe and unavoidable impurities; or a composition comprising Co: 0.1 50 atomic % added to one of the above compositions, having an aggregate structure of crystallized grains having as a main phase thereof a R2Fe14B type or R2(Fe, Co)14B type intermetallic compound having a tetragonal structure, the crystallized grains having dimensions of 0.05 - 20 µm; and individual crystallized grains comprising more than 50 volume % of the total crystallized grains comprising the aggregate structure, have a value of less than 2 of a ratio b/a of a smallest grain diameter a and a largest grain diameter b.
Ishii Yoshinari
Nakayama Ryoji
Ogawa Tamotsu
Takeshita Takuo
Marks & Clerk
Mitsubishi Materials Corporation
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