Anode structures for magnetron sputtering apparatus

Details Anode structures for magnetron sputtering apparatus Anode structures for magnetron sputtering apparatus

C - Chemistry, Metallurgy

23

C

C23C 14/35 (2006.01) C23C 14/56 (2006.01) H01J 37/34 (2006.01)

Patent

CA 2096735

2096735 9209718 PCTABS00013 An in-line sputtering system with rotating cylindrical magnetrons (30) is fitted with a system of anodes (62) having a large surface area. The surface area is equal to or greater than the surface area of the sputtering chambers' internal walls (22, 24, 25 and 26). The anodes (62) may be grounded, allowed to float electrically, or connected to a separate bias power supply. The anode surfaces are protected from contamination by sputtered material or are designed so the electron collecting surface may be replaced during the sputtering process. The anodes (62) may be equipped with a magnet array for improving electron collecting efficiency.

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