H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 5/02 (2006.01) G06F 21/00 (2006.01) G06K 19/077 (2006.01) G11C 7/24 (2006.01) H01L 23/58 (2006.01) H04L 9/10 (2006.01)
Patent
CA 2230065
An anti-tamper shield for an integrated circuit (IC) includes a bond wire which passes through a protective layer such as an epoxy encapsulating layer of the IC. The bond wire carries a signal, such as a steady state current, which allows an active component of the IC, such as a secure processor, to function. The bond wire is carried within and/or proximate to the encapsulating layer such that a decapsulation of the IC will cause a rupture of the electrically conductive member, thereby rendering the processor non-functional. The bond wire may be coupled to the processor in a variety of configurations, including the use of internal or external bond pads, lead frame contacts, and/or directly to a computer board on which the IC is carried. A metallic shield layer may be located between the active component and a top portion, of the encapsulating layer to prevent a pirate from using an electron, microscope, for example, to survey the active component region.
General Instrument Corporation Of Delaware
Ridout & Maybee Llp
LandOfFree
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