H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/18 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2232236
There is disclosed herein an electronic circuit assembly having anti-tombstoning solder joints, comprising: a substrate 10 having at least one mounting pad 20 thereon; an SMD 30 having at least one termination 40; and at least one solder joint 50 connecting each termination 40 to its respective mounting pad 20. Each solder joint 50 is convex in shape, having a continuous and substantially circular arcuate outer profile 60 and covering substantially all of the mounting pad 20 and substantially all of a top portion 42 of each termination 40. Each mounting pad 20 has a predetermined length l p and each solder joint has a predetermined volume of solder selected such that a positive net anti-tombstoning moment is exerted upon the SMD 30 when at least one solder joint 50 is in a molten state.
Présentation d'un circuit électronique comportant des joints de soudure anti-redressement. Il comprend : un substrat (10) ayant au moins une pastille de montage (20); un composant monté en surface (30) (CMS) possédant au moins une terminaison (40), et au moins un joint de soudure (50) reliant chaque terminaison (40) à sa pastille de montage (20) correspondante. Chaque joint de soudure (50) a une forme convexe et possède un profil extérieur continu, arrondi essentiellement circulaire (60) qui couvre, pour l'essentiel, toute la pastille de montage (20) et essentiellement toute la partie supérieure (42) de chaque terminaison (40). Chaque pastille de montage (20) a une longueur prédéterminée (l p) et chaque joint de soudure possède un volume prédéterminé de soudure choisi de telle sorte qu'un moment positif anti-redressement est exercé sur le CMS (30) lorsqu'au moins un joint de soudure (50) est à l'état fondu.
Jairazbhoy Vivek Amir
Mcmillan Richard Keith II
Ford Motor Company Of Canada Limited
Sim & Mcburney
LandOfFree
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