Apparatus and method for bonding conductors

Details Apparatus and method for bonding conductors Apparatus and method for bonding conductors

B - Operations, Transporting

23

K

B23K 13/00 (2006.01) B23K 1/002 (2006.01) B23K 3/047 (2006.01) H01R 43/02 (2006.01) H05K 3/36 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2322270

An apparatus and method is provided for conductively bonding at least two conductors together. An inductive coil generates a magnetic field when electrical current is run therethrough. A magnetic concentrator is disposed on or near the inductive coil and adjacent which the two conductors can be positioned for concentrating the magnetic field on the conductors. The concentrator is independent of the conductors. Pressure is applied to the conductors. The concentrator concentrates the magnetic field generated by the inductive coil on the conductors, thereby heating the conductors under pressure and electrically bonding the conductors together.

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