Apparatus and method for cleaning semiconductor wafers

Details Apparatus and method for cleaning semiconductor wafers Apparatus and method for cleaning semiconductor wafers

H - Electricity

01

L

H01L 21/46 (2006.01) B08B 3/00 (2006.01) F26B 21/00 (2006.01) F26B 21/06 (2006.01) H01L 21/00 (2006.01)

Patent

CA 2321866

The present invention relates to an apparatus and method for cleaning post- etch semiconductor wafers (230) using ultra-pure dry steam.

L'invention concerne un appareil et un procédé utilisant de la vapeur sèche ultrapure pour nettoyer des plaquettes (230) de semi-conducteur après gravure.

Affiliated with

Also associated with

Rating

Apparatus and method for cleaning semiconductor wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for cleaning semiconductor wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for cleaning semiconductor wafers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-2042183