Apparatus and method for compression moulding or embossing

Details Apparatus and method for compression moulding or embossing Apparatus and method for compression moulding or embossing

B - Operations, Transporting

29

C

18/1055, 18/1196

B29C 33/02 (2006.01) B27M 1/02 (2006.01) B29C 59/02 (2006.01) B44B 5/00 (2006.01) B44B 5/02 (2006.01)

Patent

CA 1224316

A B S T R A C T An apparatus for use in compression moulding or embossing includes at least one die adapted to be heated and pressed into the surface of an article to be moulded or embossed. The die is secured to one surface of a carrier plate which is of thermally conductive material and extends laterally beyond the edges of the die, the opposite surface of the carrier plate being attachable to means for applying heat and pressure to the die via the plate. In a method of compression moulding or embossing using such apparatus the, die is pressed into the article to a depth such that the said one surface of the carrier plate contacts the surface of the article.

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