Apparatus and method for depositing films on substrate via...

H - Electricity – 01 – L

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H01L 39/00 (2006.01) C23C 14/08 (2006.01) C23C 14/28 (2006.01) C23C 14/56 (2006.01) H01L 39/24 (2006.01) H01P 11/00 (2006.01)

Patent

CA 2171125

An apparatus and a method are provided for depositing both surfaces of the substrate in one deposition process via on-agis oriented laser ablation. For example, the first apparatus for depositing thin films according to the present invention comprises (1) a vacuum chamber, said chamber having (a) a first target supported by a first target holder, (b) a second target supported by a second target holder so as to face the first target, (c) a substrate holder for holding a substrate such that first and second surfaces of the substrate face the first and second targets, respectively, (d) a heating means for heating the substrate, (e) a first entrance window through which a first laser beam passes and strikes on the first target with a predetermined angle, and (f) a second entrance window through which a second laser beam passes and strikes on the second target with a predetermined angle and (2) a laser optical system comprising at least one laser beam source and optical path system including mirror for reflecting the laser beam from the laser beam source into the first and second targets respectively with the predetermined angles through the first and second entrance windows of the chamber.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method for depositing films on substrate via... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for depositing films on substrate via..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for depositing films on substrate via... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1608839

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.