C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
117/77, 32/82
C23C 16/44 (2006.01) C23C 18/16 (2006.01) H05K 3/00 (2006.01)
Patent
CA 1219179
ABSTRACT OF THE INVENTION An apparatus and method for the electroless plating of articles. A tank is provided for sequentially containing the respective constituent baths corresponding to the steps of the electroless plating process. An article to be plated, such as a printed circuit board, is supported in the center of the tank immersed in the constituent bath contained therein. A pair of inwardly facing parallel manifolds are disposed at opposite ends of the tank. The constituent solution is pumped through a nozzle matrix in the inward facing wall of a first manifold onto the article and is simultaneously sucked away from the opposing side of the article through the matrix of the nozzles defined in the inward facing wall of a second manifold. The direction of pumping is alternated for periodically reversing the direction of suction and impingement. The alternating pressure difference created across the surface of the article being plated substantially improves the rate of metal deposition over prior art systems and allows for a uniform and high quality plate over the entire surface of the article. Additionally, through-holes defined in the article are thoroughly and uniformly deposited with electroless metal.
437295
Etd Technology Inc.
Gowling Lafleur Henderson Llp
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