Apparatus and method for fabricating printed circuit boards

Details Apparatus and method for fabricating printed circuit boards Apparatus and method for fabricating printed circuit boards

H - Electricity

05

K

356/12, 154/40

H05K 3/10 (2006.01) B30B 15/02 (2006.01) B30B 15/06 (2006.01) H05K 3/20 (2006.01) H05K 1/00 (2006.01) H05K 1/09 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2031488

2031488 9012668 PCTABS00002 This invention relates to an apparatus and a process for uniformly laminating a conductor (18) to a substrate (15). The conductor can be a printed circuit; the substrate can be any dielectric. The apparatus comprises two platens (10, 11) containing cavities (12, 13). One of the cavities (13) contains a mold (14) which is the mirror image of a substrate surface. The other cavity (12) substantially contains the substrate (15). It can have two-dimensional or three-dimensional surfaces to which the printed circuit is laminated. The product results in a superior lamination of the printed circuit across the surface of the substrate.

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