H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/18 (2006.01) H05K 1/00 (2006.01) H05K 3/30 (2006.01) H05K 3/34 (2006.01) H05K 7/08 (2006.01)
Patent
CA 2079418
TITLE: Apparatus and Method for Manufacturing Printed Circuit Boards INVENTOR: Cody Z. Slater ABSTRACT OF THE DISCLOSURE A circuit board assembly system for manufacturing a prototype printed circuit board having a matrix formed in it. A base board having a connection matrix that matches the matrix of the printed circuit board is hinged to a frame having tracks for receiving the printed circuit board, so that the printed circuit board is locatable in a fixed position in relation to the printed circuit board with their respective matrices matching. Component leads may be inserted into the connection matrix through the printed circuit board to form a circuit, which may be tested. The base board may be pivoted away from the printed circuit board to allow the leads to be soldered. The printed circuit board may then be removed from the base board. A cover that is latchable onto the printed circuit board may be used to prevent components from being accidentally removed from the printed circuit board.
LandOfFree
Apparatus and method for manufacturing printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for manufacturing printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for manufacturing printed circuit boards will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1720251