Apparatus and method for non-destructive, low stress removal...

Details Apparatus and method for non-destructive, low stress removal... Apparatus and method for non-destructive, low stress removal...

H - Electricity

05

K

H05K 13/00 (2006.01) B23K 1/018 (2006.01)

Patent

CA 2259043

Circuit chips, such as known good die (KGD) chips, are removed from an assembly including a plurality of circuit chips attached to at least one chip carrier, or substrate. The substrate is held within a top plate with the circuit chips positioned within successive chip cavities within a bottom plate. Each chip cavity includes a load surface separated by a cascade effect pitch with respect to adjacent chip cavities. A cascade effect shear force is sequentially applied to the circuit chips to remove them from the substrate. The chips may be heated to a temperature facilitating shear within a temperature range at which solder connections are solid, and the chips further heated following disassembly to a temperature at which the solder is liquid to facilitate reforming the solder for subsequent attachment of the chip into an electronic device.

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