Apparatus and methods for packaging integrated cirguit chips...

Details Apparatus and methods for packaging integrated cirguit chips... Apparatus and methods for packaging integrated cirguit chips...

H - Electricity

01

L

H01L 23/48 (2006.01)

Patent

CA 2637038

Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications. In one aspect, an electronic apparatus (20) includes an IC chip (22) and an antenna system (23), wherein the IC chip (22) and antenna system (23) are integrally packaged together in a leaded chip-scale package (21) and wherein the antenna system (23) includes an antenna having a radiating element that is formed from a package lead wire.

L'invention concerne des dispositifs et des procédés servant à conditionner totalement dans un boîtier des puces de circuit intégré à semi-conducteur avec des antennes possédant un ou plusieurs éléments radiants ou éléments d'accord constitués de fils de connexion du boîtier présentant des formes appropriées et conçus pour des applications à des ondes millimétriques. Selon un aspect, un dispositif électronique (20) comprend une puce (22) de circuit intégré et un système d'antenne (23), cette puce (22) et ce système d'antenne (23) étant, dans leur ensemble, conditionnés dans un boîtier (21) à l'échelle de la puce pourvu de fils de connexion et le système d'antenne (23) comprenant une antenne dont un élément radiant est constitué d'un fil de connexion du boîtier.

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