Apparatus entailing adhesive bonding

Details Apparatus entailing adhesive bonding Apparatus entailing adhesive bonding

H - Electricity

01

F

H01F 3/10 (2006.01) H01F 27/26 (2006.01) H01F 41/02 (2006.01)

Patent

CA 2063847

-16- APPARATUS ENTAILING ADHESIVE BONDING Abstract Cost and performance advantage are realized in a class of magnetic core transformers and inductors in which fabrication entails joining of core portionspartially enclosed within windings. Bonding is accomplished by use of thermo- setting adhesive which is introduced in the uncured state by capillarity betweenprepositioned aleady-mated surfaces to be bonded, followed by curing.

Affiliated with

Also associated with

Rating

Apparatus entailing adhesive bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus entailing adhesive bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus entailing adhesive bonding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1819814