Apparatus for and method of controlling sputter coating

Details Apparatus for and method of controlling sputter coating Apparatus for and method of controlling sputter coating

C - Chemistry, Metallurgy

23

C

204/96.04, 204/1

C23C 14/34 (2006.01) C23C 14/54 (2006.01) H01J 37/34 (2006.01)

Patent

CA 1242989

APPARATUS FOR AND METHOD OF CONTROLLING SPUTTER COATING i A B S T R A C T The magnetic field of a magnetron sputter coating apparatus is controlled in response to measurements of plasma parameters to control deposition parameters, such as sputter deposition rate and material deposition thickness profile. From time to time the apparatus is standardized to change preset values for parameters of the plasma to manage the deposition parameters.

458138

Affiliated with

Also associated with

Rating

Apparatus for and method of controlling sputter coating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for and method of controlling sputter coating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for and method of controlling sputter coating will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1262003