Apparatus for bonding wire leads

Details Apparatus for bonding wire leads Apparatus for bonding wire leads

B - Operations, Transporting

23

K

78/45

B23K 20/10 (2006.01)

Patent

CA 1038658

APPARATUS FOR BONDING WIRE LEADS Abstract of the Disclosure An ultrasonic wobble - bonding apparatus for bonding leads of lead frames has a bonding tool attached to a support member which is mounted on a double axis pivot or trunnion, the pivot or trunnion in turn mounted on a sector bearing. The interception of the two axis is on a centre common with the active surface of the bonding tool, the active surface being concave. The tool is moved about the two axes in a predetermined manner such that the common centre on the active surface - which is also the contact position between tool and lead frames - follows a predetermined path on the active surface. The pivot and sector bearing are displaced from the bonding tool to leave a clear working space - particularly useful for automatic bonding of leads of lead frames arranged in long strips or coils. - i -

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