Apparatus for clamping metallic mold

B - Operations – Transporting – 29 – C

Patent

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18/1157

B29C 45/66 (2006.01) B25B 5/10 (2006.01) B29C 33/30 (2006.01) B29C 45/17 (2006.01) B30B 15/02 (2006.01) F16B 2/06 (2006.01) F16B 2/12 (2006.01)

Patent

CA 1188065

ABSTRACT OF THE DISCLOSURE Novel clamping apparatus for use with a die-plate is provided herein. It includes a clamp member having a stepped clamping surface, thereby providing alternative clamping levels. A spacing block is provided adjacent the clamp member, thereby providing at least two different spacing heights between the clamp member and said die-plate, the upper surface of the spacing block supporting the clamp member. A coupling member connects the spacing block with the clamp member and allows movement of the spacing block between the two operative positions. The principal advantages of this invention are ease and safety in operation.

392003

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