Apparatus for cooling integrated circuit chips

Details Apparatus for cooling integrated circuit chips Apparatus for cooling integrated circuit chips

H - Electricity

01

L

356/113

H01L 23/46 (2006.01) H01L 23/367 (2006.01) H01L 23/433 (2006.01) H05K 7/20 (2006.01)

Patent

CA 1189635

ABSTRACT A multichip thermal conduction module has improved cooling in a hous- ing having a board including chips mounted on the board. The housing is divided so as to form first and second cooling portions. The chips are in the first cooling portion. Several bellows extend into the first cooling portion so that each bellows is urged into deflecting contact with a respective chip. Many heat conducting strands are mounted in each bellows and extend into the second cool- ing portion. A fluid coolant is directed to flow across the heat conducting strands.

416162

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