Apparatus for cooling integrated circuit chips

Details Apparatus for cooling integrated circuit chips Apparatus for cooling integrated circuit chips

H - Electricity

05

K

356/3

H05K 7/20 (2006.01) H01L 23/46 (2006.01)

Patent

CA 1183611

Abstract of the Disclosure Integrated circuit chips on a surface of a board are cooled by providing respective heat sinks on the other side of the board at the locations of the chips and forcing air through the heat sinks. The heat sinks are each made of thin copper fins spaced apart by very narrow gaps. A mesh placed over the heat sink causes cooling air pressure to be increased during operation.

421302

Affiliated with

Also associated with

Rating

Apparatus for cooling integrated circuit chips does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for cooling integrated circuit chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for cooling integrated circuit chips will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1288329