Apparatus for cutting and bending leads of electronic...

B - Operations – Transporting – 23 – P

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356/22, 26/90

B23P 11/00 (2006.01) B23P 19/00 (2006.01) B23P 21/00 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1062894

ABSTRACT OF THE DISCLOSURE Apparatus for cutting and bending the leads of an electrical component which have been inserted through holes in a printed circuit board is disclosed. The apparatus includes a pair of opposed pivotal cutter levers and a pair of opposed pivotal bending levels, the levers being operable by means of a cam mechanism. Several chambers are provided to which compressed air can be supplied selectively to cause sequential operation of a drive shaft to raise the apparatus into engagement with the underside of the printed circuit board, and operation of the cam mechanism to effect cutting and bending of the leads along the under- side of the board. Each cutter lever has a groove for receiving a lead and a tube register with the groove for disposal of the cut end of the lead. One of the cutting levers incorporates an electrode arranged to contact a lead when received in the groove. This completes an electrical circuit indicating the presence of a lead and signalling continuation of the cutting and bending operation.

292856

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