C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/129
C25D 17/14 (2006.01) C25D 7/04 (2006.01)
Patent
CA 1160986
APPARATUS FOR ELECTROPLATING ABSTRACT OF THE DISCLOSURE An apparatus for electrolytically plating, cleaning, or otherwise treating a surface of revolution of a metallic workpiece. The treatment is carried out by a pair of elec- trodes each having a conductive portion and a porous dielec- tric cover that engages the surface to be treated. The elec- trodes are resiliently supported by an arm that is mounted on a shaft that is coaxial with the surface of revolution to be treated. The arm has portions extending radially outwardly from the shaft, each portion being provided with a resilient member to which an electrode is secured so that when the shaft is rotated the electrodes are moved in a circular path and are resiliently urged into engagement with the surface to be treated. Means are provided for supplying electrolyte to the electrodes and for supplying electric current to the workpiece and the electrodes to carry out the electrolytic treatment.
384020
Macrae & Co.
Sifco Industries Inc.
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